Groundbreaking scheduled for HCL–Foxconn OSAT semiconductor facility at YEIDA, UP

PIB reported that a groundbreaking ceremony for the HCL–Foxconn joint venture project (India Chip Pvt. Ltd.) is set for 21 Feb 2026 in the Yamuna Expressway Industrial Development Authority (YEIDA), Uttar Pradesh. The project is an Outsourced Semiconductor Assembly and Test (OSAT) facility to be set up under the Modified Scheme for Semiconductor Assembly, Testing, Marking and Packaging (ATMP), with total investment of over ₹3,700 crore.